New Multimodal Autonomous UAS Unveiled

ISS Aerospace, a UK innovator of cutting-edge unmanned aerial systems, has unveiled the Sensus L multi-sensor UAS, a flexible drone platform that integrates, in a modular nature, multiple, large, industrial sensors to be able to gain rapid fused mission data, utilizing edge computing.

The flagship model integrates Ground Penetrating Radar, LiDAR, Thermal, and Multispectral sensors, and utilizes a universal central payload bay, complimented by fore and aft modular sensor rails. 

According to ISS Aerospace, the system’s 25kg maximum payload capacity and efficient design enable it to carry large LiDAR sensors such as the ASTRALiTe EDGE topo-bathymetric scanner and Yellowscan Voyager/Explorer.

Data is recorded and edge-processed onboard reducing the need for large bandwidth RF links to a ground control station. Processed data is fused in the onboard Intel I9 workstation allowing for easy to interpret data sets, which support critical decision making in a timely manner.

System architecture networks the autopilot, avionics and Intel workstation with an onboard Nvidia Xavier AI board to give supercomputer-level processing opportunities in flight and in real time. A natural evolution of the architecture is for autonomous operations based on collected sensor data. As the system generates and records vast amounts, it can be used in real time for navigation, avoidance and on the fly tasking.

Ryan Kempley, Founder and CEO of ISS Aerospace, said: “It has been a long-term goal to produce a truly universal and modular UAS solution capable of delivering data from multiple sensors, in real time, to aid critical decision making in both the commercial and defense sectors. Sensus 8 now achieves this with its multi-modal, data fusion capabilities. Open architecture allows the onboard processing and universal sensor integration to be accessed and exploited by the end user.”

Several configurations of the Sensus L platform will be on display at Drone X, Excel London, on the 7-8 September, 2023.

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